KLA Alpha Step D-500 wafer profiler meter Description Maker KLA MODEL Alpha Step D-500 Content Wafer profiler meter Condition: Used, AS-IS.Wafer size: 150 mm.
IPEC 472 CMP Description Maker IPEC MODEL 472 Content The IPEC 472 uses a CMP polishing process that removes virtually any semiconductor material using polishing slurry to planarize the wafers to achieve flatness, uniformity and planarization on patterned/device wafers. The wafer polisher provides: fully automated precision polishing, processing flexibility and repeatable results. Condition: Used, AS-IS/ fully refurbished.Wafer Sizes: 2 inch, 3 inch, 100 mm, 125 mm, 150 mm and 200 mm
HSEB Zeiss Axiotron 300 AOI microscope with 2 units of Brooks load port Description Maker HSEB Zeiss MODEL Axiotron 300 Content AOI microscope with 2 units of Brooks load port Condition: Used, AS-IS.Wafer size: 300 mm.
EVG 820 mold carrier lamination Description Maker EVG MODEL 820 Content Mold carrier lamination Condition: Used, AS-IS.Wafer size: 200 mm.
EO Tech CSM3000 laser mark Description Maker EO Tech MODEL CSM3000 Content laser mark Condition: Used, AS-IS.Wafer size: 300 mm
Ebara FREX 300 CMP Frex 300( without HDD) Description Maker Ebara MODEL FREX 300 Content CMP Condition: Used, AS-IS.Wafer size: 300 mm
DNS WS-820L Bench type wafer cleaner( square solar wafer) Description Maker DNS MODEL WS-820L Content Bench type wafer cleaner Condition: Used, AS-IS.Wafer size: 150 mm.
DNS SK-2000 coater and developer(4C4D) Description Maker DNS MODEL SK-2000 Content Coater and developer Condition: Used, AS-IS.Wafer size: 200 mm.
DNS RF3S coater and developer( 5C5D) Description Maker DNS MODEL RF3S Content coater and developer( 5C5D) Condition: Used, AS-IS.Wafer size: 300 mm.
Disco DAD321 wafer dicing saw Description Maker Disco MODEL DAD321 Content Wafer dicing saw Condition: Used, AS-IS.Wafer size: 150 mm.
August NSX-105 wafer bumping inspection Description Maker August MODEL NSX-105 Content Wafer bumping inspection Condition: Used, AS-IS.Wafer size: 200 mm.
August NSX-95 auto inspection Description Maker August MODEL NSX-95 Content Auto inspection system Condition: Used, AS-IS.Wafer size: 200 mm. NSX- WHS- SERIES
August 3Di-8000 Wafer Bumping Inspection Description Maker August MODEL 3Di-8000 Content Bumping Inspection Condition: Used, AS-IS.Wafer size: 300 mm.
ASM WS896 LED sorter Description Maker ASM MODEL WS896 Content LED Sorter Condition: Used, AS-IS.Wafer size: 100 mm.